自营库存
原装正品 现货库存- 应用：
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- 绝缘高度：
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- 触头表面处理-配接：
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- 触头表面处理-柱：
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- 接线柱接触长度：
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- 加载的针脚数：
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- 触头表面处理厚度-配接：
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- 配接行间距：
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- 接合堆叠高度：
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- 配接接触长度：
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23 条记录
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描述：2.54mm Pitch SL Header, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 4 Circuits, 0.38µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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描述：2.00mm Milli-Grid Header, Vertical, Through Hole, Shrouded, 6 Circuits, 0.38µm Gold (Au) Plating, without Center Polarization Slot, with Locking Window, without PCB Locator, Tube
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描述：2.54mm SL Header, Single Row, Vertical, 3.05mm Pocket, Shrouded, 4 Circuits, 0.38µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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描述：Mini-Fit BMI Header Compliant Pin Interface, Dual Row, Vertical, 24 Circuits, 0.76µm Gold (Au) Selective Contact Plating, Tin (Sn) Press-fit Tail Plating
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描述：2.00mm Pitch MicroClasp Wire-to-Board Header, Dual Row, Vertical, 30 Circuits, with PCB Locator
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描述：2.00mm iGrid Wire-to-Board Header, Dual Row, Vertical, Tin (Sn) Plating, with PCB Locator, 24 Circuits
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描述：14 位 接头，有罩 连接器 0.079"（2.00mm） 表面贴装 金，GXT™
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